diff options
| author | Len Brown <len.brown@intel.com> | 2012-10-09 01:35:52 -0400 |
|---|---|---|
| committer | Len Brown <len.brown@intel.com> | 2012-10-09 01:35:52 -0400 |
| commit | 29b19e250434c6193c8b8e4c34c9c6284dd4f101 (patch) | |
| tree | 8a1c8e308c9ae964f7fb612e921e10cf4c30ba15 /Documentation/thermal/sysfs-api.txt | |
| parent | 125c4c706b680c7831f0966ff873c1ad0354ec25 (diff) | |
| parent | c072fed95c9855a920c114d7fa3351f0f54ea06e (diff) | |
Merge branch 'release' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux into thermal
Conflicts:
drivers/staging/omap-thermal/omap-thermal-common.
OMAP supplied dummy TC1 and TC2,
at the same time that the thermal tree removed them
from thermal_zone_device_register()
drivers/thermal/cpu_cooling.c b/drivers/thermal/cpu_cooling.c
propogate the upstream MAX_IDR_LEVEL re-name
to prevent a build failure
Previously-fixed-by: Stephen Rothwell <sfr@canb.auug.org.au>
Signed-off-by: Len Brown <len.brown@intel.com>
Diffstat (limited to 'Documentation/thermal/sysfs-api.txt')
| -rw-r--r-- | Documentation/thermal/sysfs-api.txt | 9 |
1 files changed, 8 insertions, 1 deletions
diff --git a/Documentation/thermal/sysfs-api.txt b/Documentation/thermal/sysfs-api.txt index c087dbcf3535..ca1a1a34970e 100644 --- a/Documentation/thermal/sysfs-api.txt +++ b/Documentation/thermal/sysfs-api.txt @@ -84,7 +84,8 @@ temperature) and throttle appropriate devices. 1.3 interface for binding a thermal zone device with a thermal cooling device 1.3.1 int thermal_zone_bind_cooling_device(struct thermal_zone_device *tz, - int trip, struct thermal_cooling_device *cdev); + int trip, struct thermal_cooling_device *cdev, + unsigned long upper, unsigned long lower); This interface function bind a thermal cooling device to the certain trip point of a thermal zone device. @@ -93,6 +94,12 @@ temperature) and throttle appropriate devices. cdev: thermal cooling device trip: indicates which trip point the cooling devices is associated with in this thermal zone. + upper:the Maximum cooling state for this trip point. + THERMAL_NO_LIMIT means no upper limit, + and the cooling device can be in max_state. + lower:the Minimum cooling state can be used for this trip point. + THERMAL_NO_LIMIT means no lower limit, + and the cooling device can be in cooling state 0. 1.3.2 int thermal_zone_unbind_cooling_device(struct thermal_zone_device *tz, int trip, struct thermal_cooling_device *cdev); |