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2020-06-30dt-bindings: thermal: k3: Fix the reg propertyFabio Estevam
Adjust the reg property to fix the following warning seen with 'make dt_binding_check': Documentation/devicetree/bindings/thermal/ti,am654-thermal.example.dt.yaml: example-0: thermal@42050000:reg:0: [0, 1107623936, 0, 604] is too long Signed-off-by: Fabio Estevam <festevam@gmail.com> Link: https://lore.kernel.org/r/20200630122527.28640-1-festevam@gmail.com Signed-off-by: Rob Herring <robh@kernel.org>
2020-06-30dt-bindings: thermal: Remove soc unit addressFabio Estevam
Remove the soc unit address to fix the following warnings seen with 'make dt_binding_check': Documentation/devicetree/bindings/thermal/thermal-sensor.example.dts:22.20-49.11: Warning (unit_address_vs_reg): /example-0/soc@0: node has a unit name, but no reg or ranges property Documentation/devicetree/bindings/thermal/thermal-zones.example.dts:23.20-50.11: Warning (unit_address_vs_reg): /example-0/soc@0: node has a unit name, but no reg or ranges property Signed-off-by: Fabio Estevam <festevam@gmail.com> Link: https://lore.kernel.org/r/20200630121804.27887-1-festevam@gmail.com [robh: also fix thermal-zones.yaml example] Signed-off-by: Rob Herring <robh@kernel.org>
2020-06-12Merge tag 'thermal-v5.8-rc1' of ↵Linus Torvalds
git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux Pull thermal updates from Daniel Lezcano: - Add the hwmon support on the i.MX SC (Anson Huang) - Thermal framework cleanups (self-encapsulation, pointless stubs, private structures) (Daniel Lezcano) - Use the PM QoS frequency changes for the devfreq cooling device (Matthias Kaehlcke) - Remove duplicate error messages from platform_get_irq() error handling (Markus Elfring) - Add support for the bandgap sensors (Keerthy) - Statically initialize .get_mode/.set_mode ops (Andrzej Pietrasiewicz) - Add Renesas R-Car maintainer entry (Niklas Söderlund) - Fix error checking after calling ti_bandgap_get_sensor_data() for the TI SoC thermal (Sudip Mukherjee) - Add latency constraint for the idle injection, the DT binding and the change the registering function (Daniel Lezcano) - Convert the thermal framework binding to the Yaml schema (Amit Kucheria) - Replace zero-length array with flexible-array on i.MX 8MM (Gustavo A. R. Silva) - Thermal framework cleanups (alphabetic order for heads, replace module.h by export.h, make file naming consistent) (Amit Kucheria) - Merge tsens-common into the tsens driver (Amit Kucheria) - Fix platform dependency for the Qoriq driver (Geert Uytterhoeven) - Clean up the rcar_thermal_update_temp() function in the rcar thermal driver (Niklas Söderlund) - Fix the TMSAR register for the TMUv2 on the Qoriq platform (Yuantian Tang) - Export GDDV, OEM vendor variables, and don't require IDSP for the int340x thermal driver - trivial conflicts fixed (Matthew Garrett) * tag 'thermal-v5.8-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux: (48 commits) thermal/int340x_thermal: Don't require IDSP to exist thermal/int340x_thermal: Export OEM vendor variables thermal/int340x_thermal: Export GDDV thermal: qoriq: Update the settings for TMUv2 thermal: rcar_thermal: Clean up rcar_thermal_update_temp() thermal: qoriq: Add platform dependencies drivers: thermal: tsens: Merge tsens-common.c into tsens.c thermal/of: Rename of-thermal.c thermal/governors: Prefix all source files with gov_ thermal/drivers/user_space: Sort headers alphabetically thermal/drivers/of-thermal: Sort headers alphabetically thermal/drivers/cpufreq_cooling: Replace module.h with export.h thermal/drivers/cpufreq_cooling: Sort headers alphabetically thermal/drivers/clock_cooling: Include export.h thermal/drivers/clock_cooling: Sort headers alphabetically thermal/drivers/thermal_hwmon: Include export.h thermal/drivers/thermal_hwmon: Sort headers alphabetically thermal/drivers/thermal_helpers: Include export.h thermal/drivers/thermal_helpers: Sort headers alphabetically thermal/core: Replace module.h with export.h ...
2020-06-11dt-bindings: Remove more cases of 'allOf' containing a '$ref'Rob Herring
Another round of 'allOf' removals that came in this cycle. json-schema versions draft7 and earlier have a weird behavior in that any keywords combined with a '$ref' are ignored (silently). The correct form was to put a '$ref' under an 'allOf'. This behavior is now changed in the 2019-09 json-schema spec and '$ref' can be mixed with other keywords. The json-schema library doesn't yet support this, but the tooling now does a fixup for this and either way works. This has been a constant source of review comments, so let's change this treewide so everyone copies the simpler syntax. Signed-off-by: Rob Herring <robh@kernel.org>
2020-05-29dt-bindings: thermal: rcar-thermal: Add device tree support for r8a7742Lad Prabhakar
Add thermal sensor support for r8a7742 SoC. The Renesas RZ/G1H (r8a7742) thermal sensor module is identical to the R-Car Gen2 family. No driver change is needed due to the fallback compatible value "renesas,rcar-gen2-thermal". Signed-off-by: Lad Prabhakar <prabhakar.mahadev-lad.rj@bp.renesas.com> Reviewed-by: Marian-Cristian Rotariu <marian-cristian.rotariu.rb@bp.renesas.com> Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be> Signed-off-by: Rob Herring <robh@kernel.org>
2020-05-28dt-bindings: thermal: Convert i.MX to json-schemaAnson Huang
Convert the i.MX thermal binding to DT schema format using json-schema Signed-off-by: Anson Huang <Anson.Huang@nxp.com> Reviewed-by: Dong Aisheng <aisheng.dong@nxp.com> Signed-off-by: Rob Herring <robh@kernel.org>
2020-05-27dt-bindings: thermal: rcar-gen3-thermal: Convert bindings to json-schemaNiklas Söderlund
Convert Renesas R-Car Gen3 Thermal bindings documentation to json-schema. Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be> Signed-off-by: Rob Herring <robh@kernel.org>
2020-05-22dt-bindings: thermal: Add yaml bindings for thermal zonesAmit Kucheria
As part of moving the thermal bindings to YAML, split it up into 3 bindings: thermal sensors, cooling devices and thermal zones. The thermal-zone binding is a software abstraction to capture the properties of each zone - how often they should be checked, the temperature thresholds (trips) at which mitigation actions need to be taken and the level of mitigation needed at those thresholds. Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org> Reviewed-by: Rob Herring <robh@kernel.org> Reviewed-by: Lukasz Luba <lukasz.luba@arm.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/44e5c68bc654ccaf88945f70dc875fa186dd1480.1585748882.git.amit.kucheria@linaro.org
2020-05-22dt-bindings: thermal: Add yaml bindings for thermal cooling-devicesAmit Kucheria
As part of moving the thermal bindings to YAML, split it up into 3 bindings: thermal sensors, cooling devices and thermal zones. The property #cooling-cells is required in each device that acts as a cooling device - whether active or passive. So any device that can throttle its performance to passively reduce heat dissipation (e.g. CPUs, GPUs) and any device that can actively dissipate heat at different levels (e.g. fans) will contain this property. Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org> Reviewed-by: Rob Herring <robh@kernel.org> Reviewed-by: Lukasz Luba <lukasz.luba@arm.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/7a9ead7fb67585fb70ab3ffd481e7d567e96970e.1585748882.git.amit.kucheria@linaro.org
2020-05-22dt-bindings: thermal: Add yaml bindings for thermal sensorsAmit Kucheria
As part of moving the thermal bindings to YAML, split it up into 3 bindings: thermal sensors, cooling devices and thermal zones. The property #thermal-sensor-cells is required in each device that acts as a thermal sensor. It is used to uniquely identify the instance of the thermal sensor inside the system. Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org> Reviewed-by: Rob Herring <robh@kernel.org> Reviewed-by: Lukasz Luba <lukasz.luba@arm.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/a91b5603caea5b8854cc9f5325448e4c7228c328.1585748882.git.amit.kucheria@linaro.org
2020-05-19dt-bindings: thermal: Add the idle cooling deviceDaniel Lezcano
Some devices are not able to cool down by reducing their voltage / frequency because it could be not available or the system does not allow voltage scaling. In this configuration, it is not possible to use this strategy and the idle injection cooling device can be used instead. One idle cooling device is now present for the CPU as implemented by the combination of the idle injection framework belonging to the power capping framework and the thermal cooling device. The missing part is the DT binding providing a way to describe how the cooling device will work on the system. A first iteration was done by making the cooling device to point to the idle state. Unfortunately it does not make sense because it would need to duplicate the idle state description for each CPU in order to have a different phandle and make the thermal internal framework happy. It was proposed to add an cooling-cells to <3>, unfortunately the thermal framework is expecting a value of <2> as stated by the documentation and it is not possible from the cooling device generic code to loop this third value to the back end cooling device. Another proposal was to add a child 'thermal-idle' node as the SCMI does. This approach allows to have a self-contained configuration for the idle cooling device without colliding with the cpufreq cooling device which is based on the CPU node. In addition, it allows to have the cpufreq cooling device and the idle cooling device to co-exist together as shown in the example. Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org> Link: https://lore.kernel.org/r/20200429103644.5492-2-daniel.lezcano@linaro.org
2020-05-14dt-bindings: Fix incorrect 'reg' property sizesRob Herring
The examples template is a 'simple-bus' with a size of 1 cell for had between 2 and 4 cells which really only errors on I2C or SPI type devices with a single cell. The easiest fix in most cases is to change the 'reg' property to for 1 cell address and size. In some cases with child devices having 2 cells, that doesn't make sense so a bus node is needed. Acked-by: Stephen Boyd <sboyd@kernel.org> # clk Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be> Acked-by: Geert Uytterhoeven <geert+renesas@glider.be> Signed-off-by: Rob Herring <robh@kernel.org>
2020-05-12dt-bindings: thermal: Convert UniPhier thermal monitor to json-schemaKunihiko Hayashi
Convert the UniPhier thermal monitor binding to DT schema format. Signed-off-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com> Signed-off-by: Rob Herring <robh@kernel.org>
2020-05-11dt-bindings: thermal: Convert i.MX8MM to json-schemaAnson Huang
Convert the i.MX8MM thermal binding to DT schema format using json-schema Signed-off-by: Anson Huang <Anson.Huang@nxp.com> Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org> Signed-off-by: Rob Herring <robh@kernel.org>
2020-05-03dt-bindings: Remove cases of 'allOf' containing a '$ref'Rob Herring
json-schema versions draft7 and earlier have a weird behavior in that any keywords combined with a '$ref' are ignored (silently). The correct form was to put a '$ref' under an 'allOf'. This behavior is now changed in the 2019-09 json-schema spec and '$ref' can be mixed with other keywords. The json-schema library doesn't yet support this, but the tooling now does a fixup for this and either way works. This has been a constant source of review comments, so let's change this treewide so everyone copies the simpler syntax. Scripted with ruamel.yaml with some manual fixups. Some minor whitespace changes from the script. Signed-off-by: Rob Herring <robh@kernel.org> Acked-by: Maxime Ripard <mripard@kernel.org> Acked-by: Lee Jones <lee.jones@linaro.org> Acked-By: Vinod Koul <vkoul@kernel.org> Acked-by: Mark Brown <broonie@kernel.org> Acked-by: Alexandre Belloni <alexandre.belloni@bootlin.com> Acked-by: Wolfram Sang <wsa@the-dreams.de> # for I2C Reviewed-by: Linus Walleij <linus.walleij@linaro.org> Acked-by: Jonathan Cameron <Jonathan.Cameron@huawei.com> #for-iio Reviewed-by: Stephen Boyd <sboyd@kernel.org> # clock Signed-off-by: Rob Herring <robh@kernel.org>
2020-04-16dt-bindings: Clean-up schema indentation formattingRob Herring
Fix various inconsistencies in schema indentation. Most of these are list indentation which should be 2 spaces more than the start of the enclosing keyword. This doesn't matter functionally, but affects running scripts which do transforms on the schema files. Signed-off-by: Rob Herring <robh@kernel.org> Acked-by: Maxime Ripard <mripard@kernel.org> Acked-by: Lee Jones <lee.jones@linaro.org> Acked-By: Vinod Koul <vkoul@kernel.org> Acked-by: Mark Brown <broonie@kernel.org> Acked-by: Alexandre Belloni <alexandre.belloni@bootlin.com> Signed-off-by: Rob Herring <robh@kernel.org>
2020-04-14dt-bindings: thermal: k3: Add VTM bindings documentationKeerthy
Add VTM bindings documentation. In the Voltage Thermal Management Module(VTM), K3 AM654 supplies a voltage reference and a temperature sensor feature that are gathered in the band gap voltage and temperature sensor (VBGAPTS) module. The band gap provides current and voltage reference for its internal circuits and other analog IP blocks. The analog-to-digital converter (ADC) produces an output value that is proportional to the silicon temperature. Signed-off-by: Keerthy <j-keerthy@ti.com> Reviewed-by: Rob Herring <robh@kernel.org> Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20200407055116.16082-2-j-keerthy@ti.com
2020-04-07Merge tag 'thermal-v5.7-rc1' of ↵Linus Torvalds
git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux Pull thermal updates from Daniel Lezcano: - Convert tsens configuration DT binding to yaml (Rajeshwari) - Add interrupt support on the rcar sensor (Niklas Söderlund) - Add a new Spreadtrum thermal driver (Baolin Wang) - Add thermal binding for the fsl scu board, a new API to retrieve the sensor id bound to the thermal zone and i.MX system controller sensor (Anson Huang)) - Remove warning log when a deferred probe is requested on Exynos (Marek Szyprowski) - Add the thermal monitoring unit support for imx8mm with its DT bindings (Anson Huang) - Rephrase the Kconfig text for clarity (Linus Walleij) - Use the gpio descriptor for the ti-soc-thermal (Linus Walleij) - Align msg structure to 4 bytes for i.MX SC, fix the Kconfig dependency, add the __may_be unused annotation for PM functions and the COMPILE_TEST option for imx8mm (Anson Huang) - Fix a dependency on regmap in Kconfig for qoriq (Yuantian Tang) - Add DT binding and support for the rcar gen3 r8a77961 and improve the error path on the rcar init function (Niklas Söderlund) - Cleanup and improvements for the tsens Qcom sensor (Amit Kucheria) - Improve code by removing lock and caching values in the rcar thermal sensor (Niklas Söderlund) - Cleanup in the qoriq drivers and add a call to imx_thermal_unregister_legacy_cooling in the removal function (Anson Huang) - Remove redundant 'maxItems' in tsens and sprd DT bindings (Rob Herring) - Change the thermal DT bindings by making the cooling-maps optional (Yuantian Tang) - Add Tiger Lake support (Sumeet Pawnikar) - Use scnprintf() for avoiding potential buffer overflow (Takashi Iwai) - Make pkg_temp_lock a raw_spinlock_t(Clark Williams) - Fix incorrect data types by changing them to signed on i.MX SC (Anson Huang) - Replace zero-length array with flexible-array member (Gustavo A. R. Silva) - Add support for i.MX8MP in the driver and in the DT bindings (Anson Huang) - Fix return value of the cpufreq_set_cur_state() function (Willy Wolff) - Remove abusing and scary WARN_ON in the cpufreq cooling device (Daniel Lezcano) - Fix build warning of incorrect argument type reported by sparse on imx8mm (Anson Huang) - Fix stub for the devfreq cooling device (Martin Blumenstingl) - Fix cpu idle cooling documentation (Sergey Vidishev) * tag 'thermal-v5.7-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux: (52 commits) Documentation: cpu-idle-cooling: Fix diagram for 33% duty cycle thermal: devfreq_cooling: inline all stubs for CONFIG_DEVFREQ_THERMAL=n thermal: imx8mm: Fix build warning of incorrect argument type thermal/drivers/cpufreq_cooling: Remove abusing WARN_ON thermal/drivers/cpufreq_cooling: Fix return of cpufreq_set_cur_state thermal: imx8mm: Add i.MX8MP support dt-bindings: thermal: imx8mm-thermal: Add support for i.MX8MP thermal: qcom: tsens.h: Replace zero-length array with flexible-array member thermal: imx_sc_thermal: Fix incorrect data type thermal: int340x_thermal: Use scnprintf() for avoiding potential buffer overflow thermal: int340x: processor_thermal: Add Tiger Lake support thermal/x86_pkg_temp: Make pkg_temp_lock a raw_spinlock_t dt-bindings: thermal: make cooling-maps property optional dt-bindings: thermal: qcom-tsens: Remove redundant 'maxItems' dt-bindings: thermal: sprd: Remove redundant 'maxItems' thermal: imx: Calling imx_thermal_unregister_legacy_cooling() in .remove thermal: qoriq: Sort includes alphabetically thermal: qoriq: Use devm_add_action_or_reset() to handle all cleanups thermal: rcar_thermal: Remove lock in rcar_thermal_get_current_temp() thermal: rcar_thermal: Do not store ctemp in rcar_thermal_priv ...
2020-03-31dt-bindings: thermal: tsens: Set 'additionalProperties: false'Rob Herring
Ensure the node only contains the properties listed in the schema by setting 'additionalProperties: false'. Doing this requires reworking the interrupt properties schemas so that they are defined in the main 'properties' section. Fixes: a877e768f655 ("dt-bindings: thermal: tsens: Convert over to a yaml schema") Cc: Andy Gross <agross@kernel.org> Cc: Bjorn Andersson <bjorn.andersson@linaro.org> Cc: Amit Kucheria <amit.kucheria@linaro.org> Cc: Zhang Rui <rui.zhang@intel.com> Cc: Daniel Lezcano <daniel.lezcano@linaro.org> Cc: linux-arm-msm@vger.kernel.org Cc: linux-pm@vger.kernel.org Cc: devicetree@vger.kernel.org Signed-off-by: Rob Herring <robh@kernel.org> Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
2020-03-31dt-bindings: thermal: tsens: Fix nvmem-cell-names schemaRob Herring
There's a typo 'nvmem-cells-names' in the schema which means the correct 'nvmem-cell-names' in the examples are not checked. The possible values are wrong too both in that the 2nd entry is not specified correctly and the values are just wrong based on the dts files in the kernel. Fixes: a877e768f655 ("dt-bindings: thermal: tsens: Convert over to a yaml schema") Cc: Andy Gross <agross@kernel.org> Cc: Bjorn Andersson <bjorn.andersson@linaro.org> Cc: Amit Kucheria <amit.kucheria@linaro.org> Cc: Zhang Rui <rui.zhang@intel.com> Cc: Daniel Lezcano <daniel.lezcano@linaro.org> Cc: linux-arm-msm@vger.kernel.org Cc: linux-pm@vger.kernel.org Cc: devicetree@vger.kernel.org Signed-off-by: Rob Herring <robh@kernel.org> Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
2020-03-31docs: dt: fix references to ap806-system-controller.txtMauro Carvalho Chehab
ap806-system-controller.txt was renamed to ap80x-system-controller.txt. Update its references accordingly. Fixes: 2537831bbc19 ("dt-bindings: ap80x: replace AP806 with AP80x") Signed-off-by: Mauro Carvalho Chehab <mchehab+huawei@kernel.org> Acked-by: Bartosz Golaszewski <bgolaszewski@baylibre.com> Reviewed-by: Miquel Raynal <miquel.raynal@bootlin.com> Signed-off-by: Rob Herring <robh@kernel.org>
2020-03-31dt-bindings: thermal: rcar-thermal: Convert bindings to json-schemaNiklas Söderlund
Convert Renesas R-Car Thermal bindings documentation to json-schema. Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> Signed-off-by: Rob Herring <robh@kernel.org>
2020-03-31dt-bindings: Add missing 'additionalProperties: false'Rob Herring
Setting 'additionalProperties: false' is frequently omitted, but is important in order to check that there aren't extra undocumented properties in a binding. Ideally, we'd just add this automatically and make this the default, but there's some cases where it doesn't work. For example, if a common schema is referenced, then properties in the common schema aren't part of what's considered for 'additionalProperties'. Also, sometimes there are bus specific properties such as 'spi-max-frequency' that go into bus child nodes, but aren't defined in the child node's schema. So let's stick with the json-schema defined default and add 'additionalProperties: false' where needed. This will be a continual review comment and game of wack-a-mole. Signed-off-by: Rob Herring <robh@kernel.org> Reviewed-by: Neil Armstrong <narmstrong@baylibre.com> Acked-by: Mark Brown <broonie@kernel.org> Acked-by: Jonathan Cameron <Jonathan.Cameron@huawei.com> Acked-by: Alexandru Ardelean <alexandru.ardelean@analog.com> Reviewed-by: Benjamin Gaignard <benjamin.gaignard@st.com> Acked-by: Stephen Boyd <sboyd@kernel.org> # clock Acked-by: Lee Jones <lee.jones@linaro.org>
2020-03-27dt-bindings: Clean-up schema errors due to missing 'addtionalProperties: false'Rob Herring
Numerous schemas are missing 'additionalProperties: false' statements which ensures a binding doesn't have any extra undocumented properties or child nodes. Fixing this reveals various missing properties, so let's fix all those occurrences. Signed-off-by: Rob Herring <robh@kernel.org> Reviewed-by: Neil Armstrong <narmstrong@baylibre.com> Acked-by: Alexandru Ardelean <alexandru.ardelean@analog.com> Acked-by: Jonathan Cameron <Jonathan.Cameron@huawei.com> #for-iio Acked-by: Stephen Boyd <sboyd@kernel.org> # clock Acked-by: Lee Jones <lee.jones@linaro.org> Reviewed-by: Linus Walleij <linus.walleij@linaro.org> Cc: dri-devel@lists.freedesktop.org Cc: netdev@vger.kernel.org Cc: Guillaume La Roque <glaroque@baylibre.com> Cc: linux-arm-kernel@lists.infradead.org Cc: Mark Brown <broonie@kernel.org> Cc: linux-iio@vger.kernel.org Cc: Lars-Peter Clausen <lars@metafoo.de> Cc: linux-clk@vger.kernel.org Cc: Thomas Gleixner <tglx@linutronix.de> Cc: Kevin Hilman <khilman@baylibre.com> Cc: "David S. Miller" <davem@davemloft.net> Cc: Hartmut Knaack <knaack.h@gmx.de> Cc: Peter Meerwald-Stadler <pmeerw@pmeerw.net> Cc: linux-amlogic@lists.infradead.org Cc: linux-pm@vger.kernel.org Cc: Masahiro Yamada <yamada.masahiro@socionext.com> Cc: Bartosz Golaszewski <bgolaszewski@baylibre.com> Cc: Liam Girdwood <lgirdwood@gmail.com> Cc: Mauro Carvalho Chehab <mchehab@kernel.org> Cc: linux-gpio@vger.kernel.org Cc: Daniel Lezcano <daniel.lezcano@linaro.org> Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-media@vger.kernel.org Cc: Lee Jones <lee.jones@linaro.org>
2020-03-23dt-bindings: thermal: imx8mm-thermal: Add support for i.MX8MPAnson Huang
Add thermal binding doc for Freescale's i.MX8MP Thermal Monitoring Unit. Signed-off-by: Anson Huang <Anson.Huang@nxp.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/1584674791-9717-1-git-send-email-Anson.Huang@nxp.com
2020-03-20dt-bindings: thermal: make cooling-maps property optionalYuantian Tang
Cooling-maps doesn't have to be a required property because there may be no cooling device on system, or there are no enough cooling devices for each thermal zone in multiple thermal zone cases since cooling devices can't be shared. So make this property optional to remove such limitations. For thermal zones with no cooling-maps, there could be critic trips that can trigger CPU reset or shutdown. So they still can take actions. Signed-off-by: Yuantian Tang <andy.tang@nxp.com> Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20200309045411.21859-1-andy.tang@nxp.com
2020-03-20dt-bindings: thermal: qcom-tsens: Remove redundant 'maxItems'Rob Herring
There's no need to specify 'maxItems' with the same value as the number of entries in 'items'. A meta-schema update will catch future cases. Cc: Andy Gross <agross@kernel.org> Cc: Bjorn Andersson <bjorn.andersson@linaro.org> Cc: Amit Kucheria <amit.kucheria@linaro.org> Cc: Zhang Rui <rui.zhang@intel.com> Cc: Daniel Lezcano <daniel.lezcano@linaro.org> Cc: linux-arm-msm@vger.kernel.org Cc: linux-pm@vger.kernel.org Cc: devicetree@vger.kernel.org Signed-off-by: Rob Herring <robh@kernel.org> Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20200313214552.845-2-robh@kernel.org
2020-03-20dt-bindings: thermal: sprd: Remove redundant 'maxItems'Rob Herring
There's no need to specify 'maxItems' with the same value as the number of entries in 'items'. A meta-schema update will catch future cases. Cc: Orson Zhai <orsonzhai@gmail.com> Cc: Baolin Wang <baolin.wang7@gmail.com> Cc: Chunyan Zhang <zhang.lyra@gmail.com> Cc: Zhang Rui <rui.zhang@intel.com> Cc: Daniel Lezcano <daniel.lezcano@linaro.org> Cc: Amit Kucheria <amit.kucheria@verdurent.com> Cc: linux-pm@vger.kernel.org Cc: devicetree@vger.kernel.org Signed-off-by: Rob Herring <robh@kernel.org> Reviewed-by: Baolin Wang <baolin.wang7@gmail.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20200313214552.845-1-robh@kernel.org
2020-03-20dt-bindings: thermal: rcar-gen3-thermal: Add r8a77961 supportGeert Uytterhoeven
Document R-Car M3-W+ (R8A77961) SoC bindings. Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be> Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> Acked-by: Rob Herring <robh@kernel.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20200306105503.24267-2-geert+renesas@glider.be
2020-03-12dt-bindings: thermal: imx8mm-thermal: Add binding doc for i.MX8MMAnson Huang
Add thermal binding doc for Freescale's i.MX8MM Thermal Monitoring Unit. Signed-off-by: Anson Huang <Anson.Huang@nxp.com> Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/1582947862-11073-1-git-send-email-Anson.Huang@nxp.com
2020-03-12dt-bindings: thermal: sprd: Add the Spreadtrum thermal documentationBaolin Wang
Add the Spreadtrum thermal documentation. Signed-off-by: Baolin Wang <baolin.wang@unisoc.com> Signed-off-by: Baolin Wang <baolin.wang7@gmail.com> Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/444e45ce0a9b390b2502dfcefd1ddb36948fa8e1.1582013101.git.baolin.wang7@gmail.com
2020-02-29dt-bindings: thermal: tsens: Add configuration in yamlRajeshwari
Added configuration in dt-bindings for SC7180. Signed-off-by: Rajeshwari <rkambl@codeaurora.org> Reviewed-by: Bjorn Andersson <bjorn.andersson@linaro.org> Acked-by: Rob Herring <robh@kernel.org> Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/1578317369-16045-3-git-send-email-rkambl@codeaurora.org
2020-02-24docs: dt: fix several broken references due to renamesMauro Carvalho Chehab
Several DT references got broken due to txt->yaml conversion. Those are auto-fixed by running: scripts/documentation-file-ref-check --fix Signed-off-by: Mauro Carvalho Chehab <mchehab+huawei@kernel.org> Acked-by: Andrew Jeffery <andrew@aj.id.au> Reviewed-by: Dan Murphy <dmurphy@ti.com> Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org> Signed-off-by: Rob Herring <robh@kernel.org>
2020-01-27dt-bindings: brcm,avs-ro-thermal: Fix binding check issuesStefan Wahren
Drop the reg property since this only necessary for the parent and add the missing thermal-sensor-cells property description. Signed-off-by: Stefan Wahren <stefan.wahren@i2se.com> Fixes: 37e9cc08e9678 ("dt-bindings: Add Broadcom AVS RO thermal") Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/1579200077-17496-1-git-send-email-stefan.wahren@i2se.com
2020-01-27dt-bindings: thermal: Define BCM7216 thermal sensor compatibleFlorian Fainelli
BCM7216 is a 16nm process STB chip, which requires a different compatible string to differentiate different temperature formulas. Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: Florian Fainelli <f.fainelli@gmail.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20200114190607.29339-4-f.fainelli@gmail.com
2020-01-27dt-bindings: Add Broadcom AVS RO thermalStefan Wahren
Since the BCM2711 doesn't have a AVS TMON block, the thermal information must be retrieved from the AVS ring oscillator block. This block is part of the AVS monitor which contains a bunch of raw sensors. Signed-off-by: Stefan Wahren <stefan.wahren@i2se.com> Reviewed-by: Rob Herring <robh@kernel.org> Reviewed-by: Nicolas Saenz Julienne <nsaenzjulienne@suse.de> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/1578941778-23321-2-git-send-email-stefan.wahren@i2se.com
2020-01-27dt-bindings: thermal: Add YAML schema for sun8i-thermal driver bindingsYangtao Li
sun8i-thermal driver supports thermal sensor in wide range of Allwinner SoCs. Add YAML schema for its bindings. Signed-off-by: Yangtao Li <tiny.windzz@gmail.com> Signed-off-by: Vasily Khoruzhick <anarsoul@gmail.com> Acked-by: Maxime Ripard <mripard@kernel.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20191219172823.1652600-3-anarsoul@gmail.com
2019-12-05Merge branch 'thermal/next' of ↵Linus Torvalds
git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux Pull thermal management updates from Zhang Rui: - Fix a deadlock regression in thermal core framework, which was introduced in 5.3 (Wei Wang) - Initialize thermal control framework earlier to enable thermal mitigation during boot (Amit Kucheria) - Convert the Intelligent Power Allocator (IPA) thermal governor to follow the generic PM_EM instead of its own Energy Model (Quentin Perret) - Introduce a new Amlogic soc thermal driver (Guillaume La Roque) - Add interrupt support for tsens thermal driver (Amit Kucheria) - Add support for MSM8956/8976 in tsens thermal driver (AngeloGioacchino Del Regno) - Add support for r8a774b1 in rcar thermal driver (Biju Das) - Add support for Thermal Monitor Unit v2 in qoriq thermal driver (Yuantian Tang) - Some other fixes/cleanups on thermal core framework and soc thermal drivers (Colin Ian King, Daniel Lezcano, Hsin-Yi Wang, Tian Tao) * 'thermal/next' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux: (32 commits) thermal: Fix deadlock in thermal thermal_zone_device_check thermal: cpu_cooling: Migrate to using the EM framework thermal: cpu_cooling: Make the power-related code depend on IPA PM / EM: Declare EM data types unconditionally arm64: defconfig: Enable CONFIG_ENERGY_MODEL drivers: thermal: tsens: fix potential integer overflow on multiply thermal: cpu_cooling: Reorder the header file thermal: cpu_cooling: Remove pointless dependency on CONFIG_OF thermal: no need to set .owner when using module_platform_driver thermal: qcom: tsens-v1: Fix kfree of a non-pointer value cpufreq: qcom-hw: Move driver initialization earlier clk: qcom: Initialize clock drivers earlier cpufreq: Initialize cpufreq-dt driver earlier cpufreq: Initialize the governors in core_initcall thermal: Initialize thermal subsystem earlier thermal: Remove netlink support dt: thermal: tsens: Document compatible for MSM8976/56 thermal: qcom: tsens-v1: Add support for MSM8956 and MSM8976 MAINTAINERS: add entry for Amlogic Thermal driver thermal: amlogic: Add thermal driver to support G12 SoCs ...
2019-11-07dt: thermal: tsens: Document compatible for MSM8976/56AngeloGioacchino Del Regno
Support for MSM8976 and MSM8956 (having tsens ip version 1) has been added to the qcom tsens driver: document the addition here. Signed-off-by: AngeloGioacchino Del Regno <kholk11@gmail.com> Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20191005104133.30297-3-kholk11@gmail.com
2019-11-07dt-bindings: thermal: Add DT bindings documentation for Amlogic ThermalGuillaume La Roque
Adding the devicetree binding documentation for the Amlogic temperature sensor found in the Amlogic Meson G12A and G12B SoCs. Reviewed-by: Rob Herring <robh@kernel.org> Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org> Tested-by: Christian Hewitt <christianshewitt@gmail.com> Tested-by: Kevin Hilman <khilman@baylibre.com> Signed-off-by: Guillaume La Roque <glaroque@baylibre.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20191004090114.30694-2-glaroque@baylibre.com
2019-11-07dt-bindings: thermal: tsens: Convert over to a yaml schemaAmit Kucheria
Older IP only supports the 'uplow' interrupt, but newer IP supports 'uplow' and 'critical' interrupts. Document interrupt support in the tsens driver by converting over to a YAML schema. Suggested-by: Stephen Boyd <swboyd@chromium.org> Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org> Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/d519be4c7198f47c3661f7326d1a724b97dc4973.1572526427.git.amit.kucheria@linaro.org
2019-11-07dt-bindings: thermal: rcar-gen3-thermal: Add r8a774b1 supportBiju Das
Document RZ/G2N (R8A774B1) SoC bindings. Signed-off-by: Biju Das <biju.das@bp.renesas.com> Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be> Acked-by: Rob Herring <robh@kernel.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/1569248589-52372-1-git-send-email-biju.das@bp.renesas.com
2019-10-14dt-bindings: thermal: Convert stm32 thermal bindings to json-schemaBenjamin Gaignard
Convert the STM32 thermal binding to DT schema format using json-schema Signed-off-by: Benjamin Gaignard <benjamin.gaignard@st.com> Signed-off-by: Rob Herring <robh@kernel.org>
2019-08-28dt-bindings: thermal: qoriq: Add optional clocks propertyAnson Huang
Some platforms like i.MX8M series SoCs have clock control for TMU, add optional clocks property to the binding doc. Signed-off-by: Anson Huang <Anson.Huang@nxp.com> Reviewed-by: Rob Herring <robh@kernel.org> Reviewed-by: Dong Aisheng <aisheng.dong@nxp.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2019-05-14dt-bindings: rockchip-thermal: Support the PX30 SoC compatibleElaine Zhang
Add a new compatible for thermal founding on PX30 SoCs. Signed-off-by: Elaine Zhang <zhangqing@rock-chips.com> Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org> Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2019-05-14dt-bindings: thermal: generic-adc: make lookup-table optionalJean-Francois Dagenais
Update binding description making lookup-table optional. Signed-off-by: Jean-Francois Dagenais <jeff.dagenais@gmail.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2019-05-14dt-bindings: thermal: al-thermal: Add binding documentationTalel Shenhar
Add thermal binding documentation for Amazon's Annapurna Labs Thermal Sensor. Signed-off-by: Talel Shenhar <talel@amazon.com> Reviewed-by: David Woodhouse <dwmw@amazon.co.uk> Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2019-05-14dt: thermal: tsens: Add bindings for qcs404Amit Kucheria
qcs404 uses v1 of the TSENS IP block. Create a fallback DT property "qcom,tsens-v1" to gather common code Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org> Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2019-05-13of: Add bindings of OC hw throttle for Tegra socthermWei Ni
Add OC HW throttle configuration for soctherm in DT. It is used to describe the OCx throttle events. Signed-off-by: Wei Ni <wni@nvidia.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2019-05-13of: Add bindings of gpu hw throttle for Tegra socthermWei Ni
Add "nvidia,gpu-throt-level" property to set gpu hw throttle level. Signed-off-by: Wei Ni <wni@nvidia.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
generated by cgit v1.2.3 (git 2.25.1) at 2024-07-30 14:25:34 +0000